The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2010
Filed:
Sep. 28, 2006
Applicants:
Yoichiro Kawamura, Ibi-gun, JP;
Katsuhiko Tanno, Ibi-gun, JP;
Masanori Iriyama, Ibi-gun, JP;
Sho Akai, Ibi-gun, JP;
Inventors:
Yoichiro Kawamura, Ibi-gun, JP;
Katsuhiko Tanno, Ibi-gun, JP;
Masanori Iriyama, Ibi-gun, JP;
Sho Akai, Ibi-gun, JP;
Assignee:
IBIDEN Co., Ltd., Ogaki-shi, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 31/12 (2006.01);
U.S. Cl.
CPC ...
Abstract
A solder ball is loaded on a bump having a small height (FIG.(B)) and the height of the bump is intensified by melting the solder ball by heating with laser (FIG.(C)). Thus, the heights of the bumps are adjusted within a requested allowable range. Because the bump is not removed by heating when the height of the low bump is intensified, the printed wiring board is not subjected to local heat history thereby intensifying reliability of the bump of a printed wiring board.