Masamichi Yamada

Title: Masamichi Yamada: Innovator in Copper Foil Technology

Introduction

Masamichi Yamada is a notable inventor based in Saitama, Japan. He has made significant contributions to the field of printed-wiring board technology. His innovative work focuses on enhancing the properties of copper foil used in electronic applications.

Latest Patents

Yamada holds a patent for a "Copper foil for printed-wiring board and copper-clad laminate using copper foil for printed-wiring board." The objective of this patent is to provide a copper foil that excels in selective etching properties between a resistor layer and a copper layer, which is essential for the production of printed-wiring boards. This copper foil features a nodular treatment side on one side, with a nickel-zinc alloy layer formed on the nodular treatment side. This design aims to improve UL heat resistance, making it suitable for various applications in printed-wiring boards.

Career Highlights

Masamichi Yamada is associated with Mitsui Mining & Smelting Company, Ltd., where he has been instrumental in advancing copper foil technology. His work has led to improvements in the manufacturing processes and the performance of printed-wiring boards.

Collaborations

Yamada has collaborated with notable colleagues such as Takuya Yamamoto and Masaru Takahashi. Their combined expertise has contributed to the development of innovative solutions in the field of electronics.

Conclusion

Masamichi Yamada's contributions to copper foil technology have made a significant impact on the electronics industry. His innovative patent and collaboration with esteemed colleagues highlight his role as a key inventor in this field.