The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2006
Filed:
Jul. 26, 2002
Applicants:
Takuya Yamamoto, Saitama, JP;
Masaru Takahashi, Saitama, JP;
Masamichi Yamada, Saitama, JP;
Inventors:
Assignee:
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/20 (2006.01); B32B 15/08 (2006.01); H05K 1/09 (2006.01); H05K 3/38 (2006.01); C25D 7/06 (2006.01);
U.S. Cl.
CPC ...
Abstract
The object is to provide a copper foil excellent in the property of selective etching between a resistor layer and a copper layer required in production of a printed-wiring board, and also excellent in UL heat resistance. For this purpose, a copper foil for printed-wiring board comprising a nodular treatment side on one side, wherein a nickel-zinc alloy layer is formed on the nodular treatment side is used for applications of printed-wiring boards. At the same time, a production method suitable for production of the copper foil is provided.