Shimodate, Japan

Masami Iwakura

This inventor holds 1 USPTO granted patent. Top assignee: Hitachi Techno Engineering Co., Ltd.. Active years: 1996.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masami Iwakura. Retrieved from https://idiyas.com/inventor/masami-iwakura

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 1996

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1 patent (USPTO):Explore Patents

Title: Masami Iwakura: Innovator in Multilayer Circuit Board Technology

Introduction

Masami Iwakura is a notable inventor based in Shimodate, Japan. He has made significant contributions to the field of electronics, particularly in the production of multilayer circuit boards. His innovative approach has led to the development of a unique hot press technology that enhances the manufacturing process.

Latest Patents

Iwakura holds a patent for a "Hot press for producing multilayer circuit board." This invention features a control panel that detects the viscosity of bonding resin in multilayer circuit board materials. By utilizing various sensors, the system optimizes the timing for adding air pressure, ensuring a uniform thickness in the final product without generating voids.

Career Highlights

Masami Iwakura is associated with Hitachi Techno Engineering Co., Ltd., where he has been instrumental in advancing technology related to circuit board production. His work has not only improved manufacturing efficiency but has also contributed to the overall quality of electronic components.

Collaborations

Iwakura collaborates with talented colleagues, including Akimi Miyashita and Mutsumasa Fujii. Their combined expertise fosters an environment of innovation and creativity within the company.

Conclusion

Masami Iwakura's contributions to multilayer circuit board technology exemplify the impact of innovative thinking in the electronics industry. His patent and collaborative efforts continue to shape the future of circuit board manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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