Masami Fukuyama

Title: Masami Fukuyama: Innovator in Electronic Component Packaging

Introduction

Masami Fukuyama is a notable inventor based in Higashiosaka, Japan. He has made significant contributions to the field of electronic component packaging, holding a total of 4 patents. His work focuses on innovative designs that enhance the functionality and reliability of electronic components.

Latest Patents

Fukuyama's latest patents include an electronic component mounting package and a ceramic package with an assembled substrate. The electronic component mounting package features a laminate structure formed by multiple ceramic layers, designed with a mount surface that is parallel to the laminating direction. This design includes a first ceramic layer with a recess that has an L-shaped cross-section, facilitating the mounting process on a motherboard. The second patent describes a ceramic package that incorporates one or more ceramic layers, allowing for the secure attachment of an electronic component and a lid. This package is designed with a sealing electrode and a pad for connecting to input and output electrodes, ensuring efficient functionality.

Career Highlights

Fukuyama is currently employed at Sanyo Electric Co., Ltd., where he continues to innovate in the field of electronic components. His work has been instrumental in advancing packaging technologies that are crucial for modern electronics.

Collaborations

Fukuyama has collaborated with several talented individuals, including Masanori Hongo and Natsuyo Nagano, who contribute to the innovative environment at Sanyo Electric Co., Ltd.

Conclusion

Masami Fukuyama's contributions to electronic component packaging demonstrate his commitment to innovation and excellence in technology. His patents reflect a deep understanding of the complexities involved in electronic design, making him a valuable asset in the industry.