Sanyo Electric Co., Ltd.

Masami Fukuyama

Masanori Hongo

Takashi Ogura

Natsuyo Nagano

Hiroyuki Taguchi

Hideki Ito

Hideki Takagi

A package of the present invention has a laminate structure formed by laminating a plurality of ceramic layers, and has a mount surface to be a joint surface when mounted on a mother board, defined parallel with the laminating direction. A first ceramic layer has a recess with an L-shaped cross section across the mount surface and a side surface, defined at each end thereof in a direction perpendicular to the laminating direction, and an external electrode formed on each recess, the external electrode having a surface thereof exposed to the mount surface.

Electronic component mounting package and package assembled substrate

In a ceramic package including one or more ceramic layers and being capable of having an electronic component and a lid fixed to a surface thereof, a surface of a ceramic layer having a sealing electrode for joining the lid through a sealing member and a pad to be connected to input and output electrodes and/or a ground electrode of the electronic component is divided into an inner portion having the pad and an outer portion having the sealing electrode with a stepped side wall as a border for preventing the sealing member from flowing, and one of the inner portion and the outer portion projects relative to the other.

Ceramic package, assembled substrate, and manufacturing method therefor

A package of the present invention has a laminate structure of a plurality of ceramic layers, and includes a cavity for housing a light emitting element. A mount surface is defined on a side surface parallel with the depth direction of the cavity. A pair of external electrodes each including a charged electrode portion and a coated electrode portion are formed over the entire length in the laminating direction at two corners defined by intersection of the mount surface and two side surfaces perpendicular to the mount surface. When the package is mounted, a pair of charged electrode portions and a pair of coated electrode portions are soldered to a surface of a substrate.

The present invention provides an electronic device comprising a base substrate to be surface-mounted on a circuit board, one or more electronic component elements mounted on a surface of the base substrate and/or therein, an external electrode provided on an end portion of the base substrate and in the form of a post perpendicular to a rear surface of the base substrate for connecting the one or more electronic component elements to the circuit board. Furthermore, the base substrate is provided on its end portion with a slope crossing a side surface and a rear surface of the base substrate. A surface of the external electrode is exposed on the slope.

Growing community of inventors

Higashiosaka, Japan

Masami Fukuyama