Masako Ooishi

Title: Masako Ooishi: Innovator in Semiconductor Technology

Introduction

Masako Ooishi is a prominent inventor based in Yokohama, Japan. She has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase her innovative spirit and technical expertise.

Latest Patents

Her latest patents focus on advanced semiconductor modules. One of her notable inventions is a semiconductor module that comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. Each chip has an upper surface and a lower surface, configured to face the upper surface toward the mounting board. Additionally, a drive IC chip is mounted on the mounting board by flip-chip bonding, which is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the power switching device chips, respectively. Furthermore, a resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.

Career Highlights

Masako Ooishi is associated with Kabushiki Kaisha Toshiba, a leading company in the technology sector. Her work has significantly impacted the development of semiconductor technologies, enhancing the efficiency and performance of electronic devices.

Collaborations

She has collaborated with notable coworkers, including Kazuo Shimokawa and Takashi Koyanagawa, contributing to various projects that push the boundaries of semiconductor innovation.

Conclusion

Masako Ooishi's contributions to semiconductor technology exemplify her dedication to innovation and excellence. Her patents reflect her expertise and commitment to advancing the field, making her a key figure in the industry.