Ebina, Japan

Masaki Yashiro


Average Co-Inventor Count = 2.4

ph-index = 1

Forward Citations = 7(Granted Patents)


Location History:

  • Kanagawa, JP (2007)
  • Ebina, JP (2010 - 2011)

Company Filing History:


Years Active: 2007-2011

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4 patents (USPTO):Explore Patents

Title: Masaki Yashiro: Innovator in Die Casting Technology

Introduction

Masaki Yashiro is a notable inventor based in Ebina, Japan. He has made significant contributions to the field of die casting technology, holding a total of 4 patents. His innovative methods have improved the efficiency and effectiveness of die casting processes.

Latest Patents

Yashiro's latest patents include a method for removing a casted part for use in a die casting machine. This method involves several steps, including setting a position for a chuck to grasp a casted part attached to a movable mold. It also establishes a relative positional relationship between the handle portion of the casted part and a movable die plate. The process advances the chuck between the movable mold and the fixed mold, positioning it for removal in parallel with the movement of the movable die plate. The method further includes stopping the movable die plate when the handle portion reaches the designated position, allowing the chuck to grasp the handle and remove the casted part from the movable mold.

Career Highlights

Masaki Yashiro is currently employed at Toshiba Kikai Kabushiki Kaisha, where he continues to develop innovative solutions in die casting technology. His work has been instrumental in enhancing the operational capabilities of die casting machines.

Collaborations

Yashiro collaborates with talented coworkers, including Hiroshi Yokoyama and Makoto Tsuji. Their combined expertise contributes to the advancement of technology within their field.

Conclusion

Masaki Yashiro's contributions to die casting technology exemplify the spirit of innovation. His patents and collaborative efforts continue to shape the industry, making significant strides in manufacturing processes.

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