The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2007
Filed:
Mar. 29, 2005
Makoto Tsuji, Kanagawa, JP;
Saburo Noda, Kanagawa, JP;
Shinya Itani, Kanagawa, JP;
Masaki Yashiro, Kanagawa, JP;
Hiroshi Yokoyama, Kanagawa, JP;
Makoto Tsuji, Kanagawa, JP;
Saburo Noda, Kanagawa, JP;
Shinya Itani, Kanagawa, JP;
Masaki Yashiro, Kanagawa, JP;
Hiroshi Yokoyama, Kanagawa, JP;
Toshiba Kikai Kabushiki Kaisha, Tokyo, JP;
Abstract
To provide a mold clamping apparatus able to suppress spout of a molding material from between mating faces of dies and to extend the lifetime of the dies. A mold clamping apparatus has a control apparatus deciding a distribution of a load divided by a plurality of tie bars based on information concerning to the die and controlling pressure of driving oil of a cylinder chamber of each cylinder for mold clamping independently to become a load having a determined distribution.