Aichi, Japan

Masakazu Nakada

USPTO Granted Patents = 3 

Average Co-Inventor Count = 2.6

ph-index = 2

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2006-2010

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3 patents (USPTO):Explore Patents

Title: Innovative Contributions of Masakazu Nakada in Electrical Engineering

Introduction

Masakazu Nakada, an accomplished inventor based in Aichi, Japan, has made significant strides in the field of electrical engineering. With three patents to his name, Nakada has demonstrated a commitment to improving technology through innovative solutions. His work primarily focuses on methods and materials that enhance the reliability and efficiency of electrical connections.

Latest Patents

One of Nakada's recent innovations is the patent for a multilayer wiring board and its fabrication method, aimed at improving the reliability of interlayer connections. This invention involves the formation of plural metal conductor pattern layers on a thermoplastic resin base material. A mixture containing high-melting metal (copper), low-melting metal (tin), and binder resin is packed into a via hole, followed by the application of specific heat and pressure conditions. This process results in a novel alloy layer and a reliable columnar-shaped interlayer connection, significantly enhancing the performance of multilayer wiring boards.

Additionally, Nakada has patented an electrical connection material designed to ensure reliable electrical connections between uneven surfaces. This invention includes a first film-like adhesive layer made up of multiple conductive particles and a binder, as well as a second film-like adhesive layer with a lower viscosity. This dual-layer system improves electrical connection even on uneven substrates, showcasing Nakada's innovative approach to solving complex engineering challenges.

Career Highlights

Throughout his career, Masakazu Nakada has been associated with Sony Corporation, a leading technology company known for its commitment to innovation. His roles within the company have allowed him to work on groundbreaking technologies that contribute to advancements in electrical engineering and connectivity solutions.

Collaborations

During his tenure at Sony, Nakada has collaborated with esteemed colleagues such as Noriyuki Honda and Nobuhiro Hanai. These collaborations highlight the synergistic efforts within the company to enhance product development and push the boundaries of what is possible in electrical design and technology.

Conclusion

Masakazu Nakada's work exemplifies the spirit of innovation essential in today’s rapidly changing technological landscape. His patents represent noteworthy advancements in wiring board technology and electrical connection materials, contributing to improved reliability and efficiency. As he continues his work at Sony Corporation, Nakada is poised to make further impactful contributions to the field of electrical engineering and beyond.

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