The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2006

Filed:

Apr. 28, 2005
Applicants:

Noriyuki Honda, Kanagawa, JP;

Nobuhiro Hanai, Aichi, JP;

Masakazu Nakada, Aichi, JP;

Inventors:

Noriyuki Honda, Kanagawa, JP;

Nobuhiro Hanai, Aichi, JP;

Masakazu Nakada, Aichi, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention is to provide an electrical connection material through which an electrical connection via conductive particles can be performed reliably regardless of a little unevenness of an object. The electrical connection material is an electrical connection materialfor electrically connecting an electrical connection portion of a first objectand an electrical connection portion of a second object. The electrical connection materialcomprises a first film-like adhesive layerwhich is a film-like adhesive layer arranged on the first objectand is composed of a plurality of conductive particles, a first bindercontaining the conductive particles, and a first filler Fand a second film-like adhesive layerwhich is arranged on the first film-like adhesive layerand is composed of a second binderA whose viscosity is lower than that of the first binderand a second filler F


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