Sony Corporation

Masakazu Nakada

Noriyuki Honda

Nobuhiro Hanai

Minoru Ogawa

To improve reliability of interlayer connection of a multilayer wiring board. Plural metal conductor pattern layers are formed on a base material made of thermoplastic resin. Then, high melting metal containing copper, low melting metal containing tin, and binder resin are packed into a via hole. Subsequently, predetermined heat and pressure are applied. Then, while half-melted metal mixture droplets of the low and high melting metals and melted binder resin are phase separated from each other, the surfaces of the conductor patterns that face the openings of the via and the low melting metal are alloyed with each other to form an alloy layer as well as the high and low meting metals are alloyed with each other to form a columnar-shaped interlayer connection part. As a result, an intermediate layer is formed between the outer surface of the columnar-shaped interlayer connection part and inner surface of the via hole.

Multilayer wiring board and fabricating method of the same

The present invention is to provide an electrical connection material through which an electrical connection via conductive particles can be performed reliably regardless of a little unevenness of an object. The electrical connection material is an electrical connection materialfor electrically connecting an electrical connection portion of a first objectand an electrical connection portion of a second objectThe electrical connection materialcomprises a first film-like adhesive layerwhich is a film-like adhesive layer arranged on the first objectand is composed of a plurality of conductive particlesa first bindercontaining the conductive particlesand a first filler Fand a second film-like adhesive layerwhich is arranged on the first film-like adhesive layerand is composed of a second binderA whose viscosity is lower than that of the first binderand a second filler F

Electrical connection materials and electrical connection method

The present invention is to provide an electrical connection material through which an electrical connection via conductive particles can be performed reliably regardless of a little unevenness of an object. The electrical connection material is an electrical connection materialfor electrically connecting an electrical connection portion of a first objectand an electrical connection portion of a second object. The electrical connection materialcomprises a first film-like adhesive layerwhich is a film-like adhesive layer arranged on the first objectand is composed of a plurality of conductive particles, a first bindercontaining the conductive particles, and a first filler Fand a second film-like adhesive layerwhich is arranged on the first film-like adhesive layerand is composed of a second binderA whose viscosity is lower than that of the first binderand a second filler F

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Aichi, Japan

Masakazu Nakada