logo

For the Inventor, By the Inventor

Kyoto, Japan

Masahiro Tsuji

This inventor holds 5 USPTO granted patents. Top assignee: Rohm Co., Ltd.. Active years: 1994-2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masahiro Tsuji. Retrieved from https://idiyas.com/inventor/masahiro-tsuji-cwmrx2z8

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 5

% Patents Active = 100.0

Average Co-Inventor Count = 1.3

ph-index = 4

Forward Citations = 61(Granted Patents)


Company Filing History:

goldMedal5 out of 6,022 
 
Rohm Co., Ltd.
 patents

Years Active: 1994-2002

Loading Chart...
5 patents (USPTO):Explore Patents
1. 6404066 - Semiconductor device and process for manufacturing the same (2002-06-11),
2. 5698904 - Packaging material for electronic components (1997-12-16),
3. 5672550 - Method of encapsulating semiconductor devices using a lead frame with (1997-09-30),
4. 5530282 - Semiconductor device having a multilayer interconnection structure (1996-06-25),
5. 5286342 - Method of manufacturing lead frame used in electronic component (1994-02-15),

Title: Innovations by Masahiro Tsuji

Introduction

Masahiro Tsuji is a prominent inventor based in Kyoto, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on enhancing the performance and reliability of electronic components.

Latest Patents

Tsuji's latest patents include a semiconductor device and a process for manufacturing the same. This innovation involves bonding a semiconductor chip with a polyimide bonding agent to a lead frame made of a copper alloy, which is plated with copper. The electrodes of the semiconductor chip are connected to each terminal of the lead frame using wires primarily composed of gold or copper. The bonded portions are sealed with resin, allowing for efficient semiconductor device manufacturing.

Another notable patent is for a packaging material for electronic components. This material is designed to prevent cracking of the passivation film on encapsulated chips and to inhibit the breaking of interconnecting metallization patterns. It meets the miniaturization trend for electronic components and consists of a resin and a filler made up of particles with an average size of 30 micrometers or less.

Career Highlights

Masahiro Tsuji works at Rohm Co., Ltd., a company known for its advancements in semiconductor and electronic component technologies. His innovative work has positioned him as a key figure in the industry.

Collaborations

Tsuji has collaborated with notable coworkers, including Tsunemori Yamaguchi and Osamu Miyata. Their combined expertise has contributed to the success of various projects within the company.

Conclusion

Masahiro Tsuji's contributions to semiconductor technology and electronic components have made a significant impact in the field. His innovative patents reflect his dedication to advancing technology and improving the reliability of electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…