The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 1997
Filed:
Jan. 10, 1996
Masahiro Tsuji, Kyoto, JP;
Osamu Miyata, Kyoto, JP;
Rohm Co., Ltd., Kyoto, JP;
Abstract
A method of manufacturing semiconductor devices in which a multi-series lead frame that is constructed so as to assemble semiconductor elements in a state that these elements are arrayed in a plurality of series along the longer sides of the lead frame, is set in a mold, and molding resin is injected into cavities of the mold, to thereby form packages for packing the semiconductor elements in a sealing manner. In the method, a resin tablet is positioned so that resin paths are extended at substantially equal lengths to the cavities on the lead frame set in the mold, and the molding resin is injected into the cavities disposed around the resin tablet by pressing the resin tablet with a plunger.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile