This inventor holds 1 USPTO granted patent. Top assignee: Hitachi Techno Engineering Co., Ltd.. Active years: 1995.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1995
Title: Masafumi Wada: Innovator in Reflow Soldering Technology
Introduction
Masafumi Wada is a notable inventor based in Nagareyama, Japan. He has made significant contributions to the field of electronics through his innovative patent related to reflow soldering technology. His work has implications for the efficiency and effectiveness of soldering electronic components to circuit substrates.
Latest Patents
Masafumi Wada holds a patent for a reflow soldering apparatus designed for soldering electronic parts to a circuit substrate. This apparatus utilizes various inert hot gases of desired density and temperature to enhance the soldering process. A key feature of this invention is a detection device that monitors whether a processing object is being conveyed into the apparatus. When no object is present, the system reduces the amount of inert gas supplied and the gas blowing speed, minimizing gas flow and preventing temperature drops. Conversely, when a processing object is introduced, the gas supply is increased to ensure adequate gas density, which helps prevent solder oxidation and ensures satisfactory solderability. This innovative approach has the potential to improve the reliability of electronic assemblies.
Career Highlights
Masafumi Wada is associated with Hitachi Techno Engineering Co., Ltd., where he has applied his expertise in electronics and engineering. His work has been instrumental in advancing soldering technologies, contributing to the overall efficiency of electronic manufacturing processes.
Collaborations
Throughout his career, Masafumi Wada has collaborated with notable colleagues, including Haruo Mishina and Mituo Fukuda. These collaborations have fostered an environment of innovation and have led to advancements in the field of electronics.
Conclusion
Masafumi Wada's contributions to reflow soldering technology exemplify the importance of innovation in the electronics industry. His patent not only enhances the soldering process but also addresses critical issues such as solder oxidation and efficiency. His work continues to influence the field, showcasing the impact of dedicated inventors in advancing technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile