Masae Wada

Title: Masae Wada - Innovator in Silicon Wafer Recycling

Introduction

Masae Wada is a prominent inventor based in Nagano-ken, Japan. She has made significant contributions to the field of semiconductor technology, particularly in the recycling of silicon wafers. Her innovative approach aims to enhance productivity and reduce costs in the production of silicon-on-insulator (SOI) wafers.

Latest Patents

Masae Wada holds a patent for a method of recycling a delaminated wafer and a silicon wafer used for the recycling. This patent outlines a process for reprocessing delaminated wafers, which are by-products of the hydrogen ion delaminating method used in SOI wafer production. The method includes polishing the delaminated wafer to remove steps in its peripheral part and conducting heat treatment in a reducing atmosphere containing hydrogen. This innovative approach allows for the reuse of expensive wafers, such as epitaxial wafers, thereby improving the quality and reducing the production costs of SOI wafers.

Career Highlights

Masae Wada is associated with Shin-Etsu Handotai Co., Ltd., a leading company in the semiconductor industry. Her work has been instrumental in advancing recycling methods that contribute to sustainable practices in semiconductor manufacturing.

Collaborations

Masae has collaborated with notable colleagues, including Susumu Kuwahara and Kiyoshi Mitani, who have supported her innovative endeavors in the field.

Conclusion

Masae Wada's contributions to the recycling of silicon wafers represent a significant advancement in semiconductor technology. Her innovative methods not only improve productivity but also promote sustainability in the industry.