This inventor holds 3 USPTO granted patents. Top assignee: Sgs-Thomson Microelectronics S.r.l.. Active years: 1994-1998.
Location History:
- Vaprio d'Adda, IT (1994 - 1998)
- Milan, IT (1998)
Company Filing History:
Years Active: 1994-1998
Title: Marziano Corno: Innovator in Semiconductor Packaging Technology
Introduction
Marziano Corno is a notable inventor based in Vaprio d'Adda, Italy. He has made significant contributions to the field of semiconductor packaging technology. With a total of 3 patents to his name, Corno's work focuses on enhancing the efficiency and functionality of electronic devices.
Latest Patents
One of Corno's latest patents is a heat-dissipating and supporting structure for a plastic package. This invention relates to a semiconductor electronic device encapsulated within a molded plastic material package. It features an insulated inner heat sink and a unique design that includes a heat-sink element with varying thicknesses of plastic insulation. The structure also incorporates a leadframe that enhances the device's performance by providing a peripheral holder structure.
Another significant patent involves a method for fabricating an electronic device structure with studs. This process includes a metal plate, a semiconductor material chip, terminal leads, and interconnection wires. The innovative design allows for effective electrical connections while ensuring that a portion of the beam and its connection wire are encapsulated within the plastic body.
Career Highlights
Marziano Corno is currently employed at Sgs-Thomson Microelectronics S.r.l., where he continues to develop cutting-edge technologies in semiconductor packaging. His expertise and innovative approach have positioned him as a key player in the industry.
Collaborations
Throughout his career, Corno has collaborated with talented individuals such as Paolo Casati and Giuseppe Marchisi. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Marziano Corno's contributions to semiconductor packaging technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in electronic device design and fabrication.