The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 1998
Filed:
Dec. 27, 1996
Renato Poinelli, Casatenovo, IT;
Marziano Corno, Vaprio D'Adda, IT;
SGS-Thomson Microelectronics S.r.1., Agrate Brianza, IT;
Abstract
The present invention relates to a heat-dissipating and supporting structure for a semiconductor electronic device to be encapsulated within a molded plastic material package, of the type having an insulated inner heat sink. In particular, it comprises a heat-sink element which has a first largest surface to be insulated by means of a plastic material layer with a first thickness, and a second largest surface, opposite from the first, to be insulated by means of a layer of plastic material with a second thickness which is thin compared to the first thickness; and a leadframe consisting of a metal strip attached to the heat-sink element on the same side as the first largest surface and comprising a peripheral holder structure located outside the heat-sink element. Formed in a portion of a side surface of the heat-sink element, is a relief which has mouths located on the first and second largest surfaces of the heat-sink element, the mouth formed on the first largest surface is substantially blocked by an obstructing means which extends to the heat-sink element outside, toward the peripheral holder structure, such as to only leave a slit open between the obstructing means and the peripheral holder structure of the leadframe next to the first largest surface of the heat-sink element. The mouth formed on the second largest surface is open wide.