Marvin S Pittler

Title: Innovations by Marvin S. Pittler: A Look into His Contributions

Introduction: Marvin S. Pittler, based in Poughkeepsie, NY, is an accomplished inventor with two patents to his name. His work primarily revolves around advancements in electronic packaging and integrated circuit fabrication, demonstrating his dedication to pushing the boundaries of technology.

Latest Patents: Pittler's latest patents showcase innovative techniques in the realm of electronics. One such patent is for a process of braze attachment of electronic package members. This technique details the method of attaching metallic coated connector pins to multilayer ceramic substrates. The process involves sequential coatings of molybdenum and nickel, which are heated to facilitate the diffusion of nickel. A pure gold paste is then applied using screen printing, followed by a firing step that burns out the paste binder, sintering the pure gold particles onto a dense low porosity structure. This sintering converts the nickel film into a continuous gold-nickel solid solution, essential for the reliability of electronic packages.

Another significant patent is focused on an etching process utilizing the same positive photoresist layer for two distinct masks in integrated circuit fabrication. This innovation provides a method that allows for the formation of a two-level recess pattern. It enables deeper etching of portions of the substrate that underlie the original openings in the photoresist layer, which is crucial for creating effective contact points in semiconductor circuits.

Career Highlights: Marvin S. Pittler's career is marked by his contributions to the IBM, where he has played a pivotal role in the research and development of advanced electronic packaging techniques. His inventive spirit and technical expertise have significantly enhanced the quality and performance of electronic devices.

Collaborations: Throughout his career at IBM, Pittler has had the opportunity to work alongside talented professionals, including Kenneth Chang and Raj N. Master. These collaborations have fostered an environment of innovation, leading to the successful development of novel electronic solutions.

Conclusion: Marvin S. Pittler's contributions to innovative electronic packaging and integrated circuit fabrication underscore the importance of creativity and collaboration in technology. His patents reflect a deep understanding of materials and processes, positioning him as a notable inventor in the field. As technology continues to evolve, the work of inventors like Pittler will play an essential role in shaping the future of electronic devices.