The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 1989

Filed:

Dec. 31, 1981
Applicant:
Inventors:

Raj N Master, Wappingers Falls, NY (US);

Marvin S Pittler, Poughkeepsie, NY (US);

Paul A Totta, Poughkeepsie, NY (US);

Norman G Ainslie, Croton-on-Hudson, NY (US);

Paul H Palmateer, Wappingers Falls, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
228124 ; 228232 ;
Abstract

In the process of braze attachment of electronic package members, such as attaching metallic coated connector pins to a multilayer ceramic substrate, contact areas of the substrate are formed by sequential coatings of molybdenum and nickel, which are heated to diffuse the nickel. A pure gold paste is applied by screen printing, for example, followed by the step of firing to burn out the paste binder and to sinter the pure gold particles onto a dense low porosity structure. The sintering operation converts the Ni film into a continuous Au-Ni solid solution. During pin braze, Ni-Sn intermetallics are dispersed in a gold rich matrix of the Au-Ni solid solution.


Find Patent Forward Citations

Master, Raj. (1989). Process for braze attachment of electronic package members (U.S. Patent No. 4824009). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4824009

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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