Graduated from:
- Simon Fraser University (Canada)
- University of Iowa (USA)
Company Filing History:

Years Active: 2018-2025
Title: Martin Thuo - Pioneering Innovations in Metallic Materials
Introduction
Martin Thuo is an esteemed inventor located in Ames, IA, who has made significant contributions to the field of materials science with a remarkable portfolio of 25 patents. His work, which focuses on the innovative manipulation of metallic materials, showcases a blend of creativity and scientific rigor.
Latest Patents
Among his latest patents, Thuo has developed a method for direct printing and writing using undercooled metallic core-shell particles. This groundbreaking technology involves depositing an ink containing undercooled liquid metallic particles dispersed in a carrier fluid onto various substrates to create intricate patterns and layered structures. Additionally, he has made strides in solder materials, inventing a composite that includes supercooled micro-capsules each encasing a liquid metallic core, complemented by alloyed metallic particles and flux. This invention enhances thermal performance and reliability in soldering applications by forming a new alloy with a higher melting temperature during heating.
Career Highlights
Martin Thuo's career is marked by his collaborations with prestigious institutions like Iowa State University Research Foundation and the University of Massachusetts. His research not only emphasizes novel applications of materials but also bridges the gap between theoretical concepts and practical implementations.
Collaborations
Throughout his career, Thuo has collaborated with talented individuals such as Ian Tevis and Boyce S Chang. These collaborations have facilitated the exchange of ideas and fostered innovation in the development of advanced materials.
Conclusion
Martin Thuo remains a prominent figure in the realm of materials innovation, with his 25 patents reflecting an exceptional dedication to advancing technology. His contributions are paving the way for new applications in various industries, demonstrating the transformative potential of undercooled metals and enhanced solder materials.
