Martin Thuo

Apex, NC, United States of America

Martin Thuo

This inventor holds 29 USPTO granted patents and 9 published patent applications and 2 EPO patents, primarily in Metallic Particle Engineering. Top assignees: Iowa State University Research Foundation Inc., Indium Corporation of America, University of Massachusetts. Active years: 2018-2026. Education: Simon Fraser University (Canada); University of Iowa (USA).

IDiyas Innovation Intelligence. (2026). Inventor Profile: Martin Thuo. Retrieved from https://idiyas.com/inventor/martin-thuo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Graduated from:
  • Simon Fraser University (Canada)
  • University of Iowa (USA)
USPTO Granted Patents = 29 

% Patents Active = 93.1

 

Average Co-Inventor Count = 2.7

ph-index = 4

Forward Citations = 69(Granted Patents)


Company Filing History:


Years Active: 2018-2026

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Areas of Expertise:
Undercooled Metallic Particles
Core-Shell Particles
Solder Materials
Photolithography
Additive Manufacturing
Micro-Particles
Nano-Particles
Surface Coatings
Metal Alloys
Self-Strengthening Composites
Textured Particles
Dry-Type Lubricants
29 patents (USPTO):Explore Patents

Title: Martin Thuo - Pioneering Innovations in Metallic Materials

Introduction

Martin Thuo is an esteemed inventor located in Ames, IA, who has made significant contributions to the field of materials science with a remarkable portfolio of 25 patents. His work, which focuses on the innovative manipulation of metallic materials, showcases a blend of creativity and scientific rigor.

Latest Patents

Among his latest patents, Thuo has developed a method for direct printing and writing using undercooled metallic core-shell particles. This groundbreaking technology involves depositing an ink containing undercooled liquid metallic particles dispersed in a carrier fluid onto various substrates to create intricate patterns and layered structures. Additionally, he has made strides in solder materials, inventing a composite that includes supercooled micro-capsules each encasing a liquid metallic core, complemented by alloyed metallic particles and flux. This invention enhances thermal performance and reliability in soldering applications by forming a new alloy with a higher melting temperature during heating.

Career Highlights

Martin Thuo's career is marked by his collaborations with prestigious institutions like Iowa State University Research Foundation and the University of Massachusetts. His research not only emphasizes novel applications of materials but also bridges the gap between theoretical concepts and practical implementations.

Collaborations

Throughout his career, Thuo has collaborated with talented individuals such as Ian Tevis and Boyce S Chang. These collaborations have facilitated the exchange of ideas and fostered innovation in the development of advanced materials.

Conclusion

Martin Thuo remains a prominent figure in the realm of materials innovation, with his 25 patents reflecting an exceptional dedication to advancing technology. His contributions are paving the way for new applications in various industries, demonstrating the transformative potential of undercooled metals and enhanced solder materials.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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