The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2025

Filed:

Dec. 13, 2022
Applicant:

The Indium Corporation of America, Clinton, NY (US);

Inventors:

Martin Thuo, Ames, IA (US);

Ian Tevis, Ames, IA (US);

Dana Drochner, Boone, IA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/02 (2006.01); B22F 1/00 (2022.01); B22F 1/16 (2022.01); B22F 1/17 (2022.01); B23K 35/26 (2006.01);
U.S. Cl.
CPC ...
B23K 35/0244 (2013.01); B22F 1/09 (2022.01); B22F 1/16 (2022.01); B22F 1/17 (2022.01); B23K 35/262 (2013.01); B23K 35/264 (2013.01); B22F 2301/30 (2013.01);
Abstract

A material includes a plurality of supercooled micro-capsules each including a metallic core in a liquid state at a temperature below a solidification temperature of the metallic core and further includes a metallic shell surrounding each respective metallic core. A plurality of alloyed metallic particles and flux are mixed with the plurality of supercooled micro-capsules to form a solder paste. Upon heating the solder paste, the plurality of alloyed particles melt. As the metallic shells destabilize, the liquid metallic cores interdiffuse with the melted alloyed particles forming a new alloy that has a higher melting temperature than the melting temperature of the alloyed metallic particles.


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