Stuttgart, Germany

Martin Kunz

This inventor holds 1 USPTO granted patent. Top assignee: Xsys Germany Gmbh. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Martin Kunz. Retrieved from https://idiyas.com/inventor/martin-kunz-3261jx7k

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Martin Kunz: Inventor of a Photosensitive Composition

Introduction

Martin Kunz is an inventor associated with Stuttgart, Germany, and Xsys Germany GmbH. His patent work includes a photosensitive composition designed for use in a developable relief precursor.

Latest Patents

The supplied information identifies one patent associated with Martin Kunz: “Photosensitive composition.” It describes a composition containing an at least partially hydrolyzed ethylene-vinyl acetate copolymer, an ethylenically unsaturated compound, a photoinitiator or photoinitiator system, and a water-soluble or water-dispersible binder. The copolymer’s specified content of CH—CH— groups is below 20 mol%, with lower preferred thresholds of 15 mol% and 10 mol%. The composition is intended for a developable relief precursor. The provided patent count is 1 patent.

Career Highlights

The available details connect Kunz’s invention to Xsys Germany GmbH. The patent’s focus on polymer composition and photosensitive materials reflects work in the development of relief-forming technologies.

Collaborations

The supplied information names Xsys Germany GmbH as the company associated with Kunz. It does not specify additional collaborators or co-inventors.

Conclusion

Martin Kunz’s documented patent contribution is a photosensitive composition for developable relief precursors, associated with Xsys Germany GmbH and his work in Stuttgart, Germany.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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