The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Nov. 10, 2021
Xsys Germany Gmbh, Willstätt, DE;
Martin Kunz, Stuttgart, DE;
Christian Pietsch, Stuttgart, DE;
XSYS GERMANY GMBH, Willstätt, DE;
Abstract
A photosensitive composition of a developable relief precursor includes at least one copolymer as component C, at least one ethylenically unsaturated compound as component U, at least one photoinitiator or photoinitiator system as component P, and at least one water soluble and/or water dispersible binder as component B. The at least one copolymer as component C is an at least partially hydrolyzed ethylene vinyl acetate copolymer, including CH—CH— groups, and the content of the CH—CH— groups in the partially hydrolyzed ethylene vinyl acetate copolymer is lower than 20 mol %, preferably lower than 15 mol %, more preferably lower than 10 mol %.