This inventor holds 1 USPTO granted patent. Top assignee: Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno. Active years: 2017.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2017
Title: Martin K P Van Neer: Innovator in Releasable Substrate Technology
Introduction
Martin K P Van Neer is a notable inventor based in The Hague, Netherlands. He has made significant contributions to the field of adhesive technology, particularly with his innovative approach to releasable substrates.
Latest Patents
Van Neer holds a patent for a method and system that provides a releasable substrate on a carrier. The patent describes a process that includes providing a carrier with a bonding layer of radiation curable adhesive. It involves selectively irradiating a first area subsection of the bonding layer with radiation to partially cure it. The method allows for the formation of an adhesion area between the substrate and the bonding layer, with varying adhesion forces that enhance the release capabilities of the substrate.
Career Highlights
He is associated with the Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek TNO, where he has been able to apply his expertise in adhesive technologies. His work has led to advancements in the efficiency and effectiveness of bonding materials used in various applications.
Collaborations
Some of his notable coworkers include Karin Tempelaars and Linda B Van Leuken, who have collaborated with him on various projects within the organization.
Conclusion
Martin K P Van Neer is a distinguished inventor whose work in releasable substrate technology has paved the way for innovative solutions in adhesive applications. His contributions continue to influence the field positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile