The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9656440 B1

PDF
Full Text
Expired
Date of Patent:
May. 23, 2017

Filed:

Oct. 04, 2013
Applicant:

Nederlandse Organisatie Voor Toegepast-natuurwetenschappelijk Onderzoek Tno, 's-Gravenhage, NL;

Inventors:

Martin K. P. van Neer, 's-Gravenhage, NL;

Karin Tempelaars, 's-Gravenhage, NL;

Linda B. van Leuken, 's-Gravenhage, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/02 (2006.01); B32B 7/12 (2006.01); B32B 37/00 (2006.01); B32B 39/00 (2006.01); B32B 37/12 (2006.01); B32B 38/00 (2006.01); B32B 7/14 (2006.01);
U.S. Cl.
CPC ...
B32B 7/12 (2013.01); B32B 7/14 (2013.01); B32B 37/0046 (2013.01); B32B 37/12 (2013.01); B32B 38/0008 (2013.01); B32B 39/00 (2013.01); B32B 2037/1253 (2013.01); B32B 2307/546 (2013.01); B32B 2310/0831 (2013.01); B32B 2311/00 (2013.01); B32B 2457/00 (2013.01); B32B 2457/20 (2013.01); Y10T 156/1052 (2015.01); Y10T 428/24851 (2015.01);
Abstract

A method and system provide a releasable substrate on a carrier. The method includes providing the carrier with a bonding layer of radiation curable adhesive; selectively irradiating a first area subsection of the bonding layer with a first radiation for selectively at least partially curing the first area subsection; bringing a substrate in contact with the first area subsection and a second area subsection of the bonding layer; and curing the second area subsection in contact with the substrate for forming an adhesion area between the second area subsection and the substrate. The first area subsection forms a release area with an adhesion force between the bonding layer and the substrate lower in the release area than in the adhesion area as a result of the first area subsection being more cured than the second area subsection prior to being in contact with the substrate.


Find Patent Forward Citations

Loading…