Martin J Wilheim is a notable inventor based in Larchmont, NY (US). He has made significant contributions to the field of protective film technology, particularly in applications related to printed circuit boards (PCBs). With a total of 4 patents to his name, Wilheim's work focuses on enhancing the handling and processing of thin copper foils and other shiny substrates.

Latest Patents

Wilheim's latest patents include a groundbreaking method and apparatus for protecting thin copper foil during handling and rigorous processing. His invention utilizes electric-charge adherence to apply thin release-layered plastic films, ensuring that the original pristine surface of the copper foil remains uncontaminated. Another notable patent involves a method for protecting substrate sheets, such as conductive foils, by applying a lamination mold-release layer and an electron beam curable adhesive. This innovative approach allows for the peelable detachment of the protective film, safeguarding the substrate during handling and storage.

Career Highlights

Throughout his career, Martin J Wilheim has worked with various companies, including Metallized Products, Inc. His expertise in protective film technology has positioned him as a key figure in the industry, contributing to advancements that improve product quality and processing efficiency.

Collaborations

Wilheim has collaborated with notable professionals in the field, including Allen H Keough and Edwin P Tripp, III. These collaborations have further enriched his work and expanded the impact of his inventions.

Conclusion

Martin J Wilheim's innovative contributions to protective film technology have significantly advanced the manufacturing processes for printed circuit boards and similar applications. His patents reflect a commitment to improving product integrity and efficiency in handling delicate materials.

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