The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6921451 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 26, 2005

Filed:

Jun. 28, 2002
Applicant:

Martin J. Wilheim, New York, NY (US);

Inventor:

Martin J. Wilheim, New York, NY (US);

Assignee:

Metallized Products, Inc., Winchester, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B031/12 ;
U.S. Cl.
CPC ...
Abstract

An improved method of and apparatus for producing preferably thin plastic protective film layers for thin shiny copper foils and the like, as for PCB applications, with electric-charge adhering of the same to the foil and with peel-off releasable properties to provide the same original pristine, shiny copper foil surface without contamination, marring or other physical, chemical or other residue despite handling and other processing procedures.


Find Patent Forward Citations

Wilheim, Martin. (2005). Method of and apparatus for protecting thin copper foil and other shiny substrates during handling and rigorous processing, as pcb manufacture and the like, by electric-charge adherence thereto of thin release-layered plastic films and the like, and improved products produced thereby (U.S. Patent No. 6921451). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6921451

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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