Martin A Spannagel

Title: Martin A Spannagel: Innovator in Photonics and Electronics Integration

Introduction

Martin A Spannagel is a prominent inventor based in San Francisco, CA, known for his significant contributions to the field of photonics and electronics integration. With a total of six patents to his name, Spannagel has developed innovative methods that enhance the capabilities of semiconductor technologies.

Latest Patents

One of Spannagel's latest patents focuses on atomic layer deposition bonding for heterogeneous integration of photonics and electronics. This patent presents methods and systems that utilize atomic layer deposition (ALD) bonding to achieve seamless integration. The process involves forming a compound semiconductor and depositing a continuous film of a protection material, such as AlO, on its surface. Additionally, the method includes creating a silicon on insulator (SOI) wafer that contains one or more waveguides. The bonding of the compound semiconductor to the SOI wafer results in a bonded structure that is further processed, with the protection material safeguarding the semiconductor from acid etchants during this phase.

Career Highlights

Throughout his career, Martin A Spannagel has worked with notable companies, including Juniper Networks, Inc. and Openlight Photonics, Inc. His experience in these organizations has allowed him to refine his expertise in semiconductor technologies and contribute to groundbreaking innovations.

Collaborations

Spannagel has collaborated with esteemed colleagues, including John Parker and Gregory Alan Fish. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and advancements in technology.

Conclusion

Martin A Spannagel stands out as a key figure in the integration of photonics and electronics, with a strong portfolio of patents that reflect his innovative spirit. His work continues to influence the field and pave the way for future advancements in semiconductor technology.