Martin A Hemmerling

Title: Martin A. Hemmerling: Innovator in Microelectronic Testing

Introduction

Martin A. Hemmerling is a notable inventor based in Menlo Park, CA (US). He has made significant contributions to the field of microelectronics, particularly in the testing of microelectronic dies. With a total of 3 patents to his name, Hemmerling's work has advanced the methodologies used in the industry.

Latest Patents

One of Hemmerling's latest patents is focused on the reloading of die carriers without the need to remove them from sockets on test boards. This innovative method allows for a set of dies to be inserted into die carrier bodies that are held within sockets on a burn-in board. The process involves closing die carrier covers over the dies, conducting burn-in testing in an oven, and subsequently removing the dies without detaching the carrier bodies from the sockets. Another patent details the design of a die carrier specifically for use in a TSOP socket. This die carrier features a carrier substrate with contacts that align perfectly with the socket contacts, ensuring efficient insertion and minimizing the risk of damage.

Career Highlights

Hemmerling is currently employed at Aehr Test Systems, Inc., where he continues to develop innovative solutions for the microelectronics industry. His expertise in die carrier design and testing methodologies has positioned him as a key player in his field.

Collaborations

Throughout his career, Hemmerling has collaborated with various professionals, including his coworker Seang P. Malathong. These collaborations have further enhanced the development of advanced testing techniques and products.

Conclusion

Martin A. Hemmerling's contributions to microelectronic testing through his patents and work at Aehr Test Systems, Inc. highlight his role as an influential inventor in the industry. His innovative approaches continue to shape the future of microelectronics.