This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2006.
Company Filing History:
Years Active: 2006
Title: Martha Jones: Innovator in Microelectronic Device Packaging
Introduction
Martha Jones is a prominent inventor based in Portland, OR (US). She has made significant contributions to the field of microelectronics, particularly in the packaging of microelectronic devices. Her innovative approach has led to the development of a patented method that enhances the efficiency and reliability of semiconductor packaging.
Latest Patents
Martha holds a patent for a "Method for packaging a microelectronic device using on-die bond pad expansion." This patent describes a process where expanded bond pads are formed over a passivation layer on a semiconductor wafer before the wafer is diced into individual circuit chips. After dicing, each chip is packaged by fixing it within a package core and building up one or more metallization layers on the resulting assembly. In at least one embodiment, a high melting temperature (lead-free) alternative bump metallurgy (ABM) form of controlled collapse chip connect (C4) processing is utilized to create relatively wide conducting platforms over the bond pads on the wafer. Martha's innovative method has the potential to improve the performance and longevity of microelectronic devices.
Career Highlights
Martha is currently employed at Intel Corporation, where she continues to push the boundaries of technology in microelectronics. Her work at Intel has allowed her to collaborate with some of the brightest minds in the industry, contributing to advancements that benefit a wide range of applications.
Collaborations
Martha has worked alongside talented colleagues, including Quat T Vu and Steven N Towle. Their collaborative efforts have fostered an environment of innovation and creativity, leading to groundbreaking developments in microelectronic packaging.
Conclusion
Martha Jones is a trailblazer in the field of microelectronics, with a patented method that showcases her innovative spirit. Her contributions at Intel Corporation and her collaborations with esteemed colleagues highlight her commitment to advancing technology. Martha's work continues to influence the future of microelectronic device packaging.