Eschenbach, Germany

Markus Rüppel

This inventor holds 1 USPTO granted patent. Top assignee: Rogers Germany Gmbh. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Markus Rüppel. Retrieved from https://idiyas.com/inventor/markus-ruppel

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Markus Rüppel: Inventor of a Metal-Ceramic Substrate Manufacturing Method.

Introduction

Markus Rüppel is an inventor based in Eschenbach, Germany. He is associated with Rogers Germany GmbH and is named on 1 patent concerning the production of metal-ceramic substrates.

Latest Patents

Rüppel’s patent, “Method for Producing a Metal-Ceramic Substrate, and Metal-Ceramic Substrate Produced Using a Method of This Type,” describes joining a ceramic element to at least one metal layer to form a substrate. The components extend along a main extension plane, and the joining may use direct metal joining, hot isostatic pressing, or soldering. The method then machines the metal layer with a machine tool or laser light to define at least part of a side face that does not run parallel to the main extension plane.

Career Highlights

Rüppel’s recorded patent work focuses on manufacturing and shaping metal-ceramic substrates. The invention combines a joining process with subsequent machining to produce a defined side-face geometry.

Collaborations

Rüppel is associated with Rogers Germany GmbH. His listed coworkers include Vitalij Gil and Marco Englhard.

Conclusion

Markus Rüppel’s patent describes a process for joining ceramic and metal components and machining the metal layer to create a specified substrate geometry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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