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For the Inventor, By the Inventor

Eschenbach, Germany

Rogers Germany Gmbh


USPTO Granted Patents = 31


Trademarks = 2

Forward Citations = 20

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31 inventors (with patents filed for the assignee):

goldMedal Andreas Meyer (19 out of 25 patents)

silverMedal Stefan Britting (12 out of 13 patents)

bronzeMedal Karsten Schmidt (10 out of 12 patents)

4.  Tilo Welker (5 out of 5 patents)

5.  Heiko Schweiger (4 out of 4 patents)

6.  Johannes Wiesend (4 out of 4 patents)

7.  Vitalij Gil (4 out of 4 patents)

8.  Xinhe Tang (3 out of 3 patents)

9.  Jürgen Schulz-Harder (3 out of 31 patents)

10.  Erich Ernstberger (2 out of 2 patents)

11.  László Müller (2 out of 2 patents)

12.  Rainer Herrmann (2 out of 2 patents)

13.  Fabian Wagle (2 out of 2 patents)

14.  Andrea Adler (1 out of 1 patent)

15.  Thilo Vethake (1 out of 11 patents)


Core Competencies:
Cooling Element
Metal-Ceramic Substrate
Electronics Module
Solder Material
Support Substrate
Carrier Substrate
Cooling Device
Composite Material
Adapter Element
Electrical Components
Packaging Unit

31 patents:

1. 12683355 - Method for producing a cooling element, and cooling element produced using such a method (2026-07-14),
2. 12677661 - Method for producing a cooling element, and cooling element produced using such a method (2026-07-07),
3. 12623305 - Method for machining a metal-ceramic substrate, system for such a method and metal-ceramic substrates produced using such a method (2026-05-12),
4. 12575440 - Electronics module and method for producing it (2026-03-10),
5. 12552722 - Process for producing a metal-ceramic substrate, and a metal-ceramic substrate produced using such a method (2026-02-17),
6. 12531390 - Adapter element for connecting an electronics component to a heat sink element, system comprising an adapter element of this kind, and method for producing an adapter element of this kind (2026-01-20),
7. 12495491 - Process for producing a metal-ceramic substrate, and a metal-ceramic substrate produced using such method (2025-12-09),
8. 12226856 - Solder material, method for producing a solder material of this type and use of a solder material of this type in order to connect a metal layer to a ceramic layer (2025-02-18),
9. 12177970 - Support substrate and method for producing a support substrate (2024-12-24),
10. 12075557 - Metal ceramic substrate and method for manufacturing such metal ceramic substrate (2024-08-27),
11. 12058816 - Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using such a method (2024-08-06),
12. 12035477 - Electronic module and method for producing an electronic module (2024-07-09),
13. 11945054 - Method for producing a metal-ceramic substrate, solder system, and metal-ceramic substrate produced using such a method (2024-04-02),
14. 11848248 - System for cooling a metal-ceramic substrate, a metal-ceramic substrate and method for manufacturing the system (2023-12-19),
15. 11845700 - Method for producing a semi-finished metal product, method for producing a metal-ceramic substrate, and metal-ceramic substrate (2023-12-19),
Rogers Germany GmbH, located in Eschenbach, specializes in advanced materials and solutions for a variety of industries, including telecommunications, automotive, and aerospace. The company focuses on developing high-performance materials that enhance the efficiency and reliability of electronic devices. With a commitment to innovation, Rogers Germany leverages its expertise in engineering and manufacturing to support the evolving needs of its global clientele, ensuring cutting-edge solutions that meet rigorous industry standards.
Profile summary based on public USPTO records.

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USPTO Data Jan 1 1976 - Sep 29 2026

31 Patents

#1 in Eschenbach

#1,558 in Germany

#21,217 in the World

Eschenbach, DE
Eschenbach, Germany

Rogers Germany Gmbh

Forward Citations = 20

31 inventors:

goldMedal Andreas Meyer (19 out of 25 patents)

silverMedal Stefan Britting (12 out of 13 patents)

bronzeMedal Karsten Schmidt (10 out of 12 patents)

4.  Tilo Welker (5 out of 5 patents)

5.  Heiko Schweiger (4 out of 4 patents)

Please report any incorrect information to [email protected]
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