The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2025
Filed:
Dec. 03, 2020
Applicant:
Rogers Germany Gmbh, Eschenbach, DE;
Inventors:
Assignee:
ROGERS GERMANY GMBH, Eschenbach, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 35/02 (2006.01); B23K 101/36 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B23K 35/0238 (2013.01); B23K 1/0016 (2013.01); B23K 2101/36 (2018.08); B23K 2103/52 (2018.08);
Abstract
A solder material () for bonding a metal layer () to a ceramic layer (), in particular for forming a metal-ceramic substrate as a carrier for electrical components, comprising:
Quick Actions:
Britting, Stefan. (2025). Solder material, method for producing a solder material of this type and use of a solder material of this type in order to connect a metal layer to a ceramic layer (U.S. Patent No. 12226856). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12226856
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile