This inventor holds 1 USPTO granted patent. Top assignee: Brown, Boveri & Cie Ag. Active years: 1985.
Company Filing History:
Years Active: 1985
Title: Mark Wittmer: Innovator in Direct Bonding Technologies
Introduction
Mark Wittmer is a notable inventor based in Baden, Switzerland. He has made significant contributions to the field of materials science, particularly in the area of bonding technologies. His innovative approach has led to the development of a unique method that enhances the performance and reliability of electronic components.
Latest Patents
Mark Wittmer holds a patent for a "Method of direct bonding copper foils to oxide-ceramic substrates." This method involves directly bonding copper foils that have a copper oxide layer to oxide-ceramic substrates. The process requires heating the ceramic substrate covered with the copper foil in an oxygen-containing atmosphere to a temperature above the eutectic temperature of Cu and Cu₂O, but below the melting temperature of copper. This is achieved in a vacuum furnace at a pressure of not more than 1 mbar, while maintaining a furnace atmosphere with a partial oxygen pressure between 0.001 and 0.1 mbar. This innovative method has the potential to improve the durability and efficiency of electronic devices.
Career Highlights
Mark Wittmer is currently employed at Brown, Boveri & Cie AG, a company known for its advancements in electrical engineering and technology. His work at this esteemed organization has allowed him to further develop his expertise in bonding technologies and contribute to various projects that push the boundaries of innovation.
Collaborations
Throughout his career, Mark has collaborated with talented individuals such as Arno Neidig and Dietmar Berndt. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
Mark Wittmer's contributions to the field of direct bonding technologies exemplify the spirit of innovation. His patented method for bonding copper foils to oxide-ceramic substrates represents a significant advancement in materials science. As he continues to work at Brown, Boveri & Cie AG, his future endeavors are likely to yield even more impactful inventions.