The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 1985
Filed:
Dec. 12, 1983
Applicant:
Inventors:
Arno Neidig, Plankstadt, DE;
Dietmar Berndt, Heidelberg, DE;
Georg Wahl, Eppelheim, DE;
Mark Wittmer, Baden, CH;
Assignee:
Brown, Boveri & Cie AG, Mannheim, DE;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
228122 ; 228124 ; 228198 ; 228219 ;
Abstract
Method for directly bonding copper foils having a copper oxide layer to oxide-ceramic substrates by heating the ceramic substrate covered with the copper foil in an oxygen-containing atmosphere to a temperature above the eutectic temperature of Cu and Cu.sub.2 O, but below the melting temperature of copper in a vacuum furnace at a pressure of not more than 1 mbar while maintaining a furnace atmosphere with a partial oxygen pressure between 0.001 and 0.1 mbar.