Chandler, AZ, United States of America

Mark Sackett

This inventor holds 2 USPTO granted patents. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2023-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mark Sackett. Retrieved from https://idiyas.com/inventor/mark-sackett-8nke35a1

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2023-2025

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2 patents (USPTO):Explore Patents

Title: Mark Sackett: Innovator in Semiconductor Technology

Introduction

Mark Sackett is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

One of Mark Sackett's latest patents is a semiconductor device and method of forming a bump pad array on a substrate for ground connection for heat sink/shielding structure. This innovative semiconductor device features a substrate with a plurality of first bumps arranged in an array. Additionally, an array of second bumps is formed over the substrate on at least two sides of the first bumps. An electrical component is positioned over the first bumps, while a package structure is placed over both the substrate and the electrical component. This package structure includes a horizontal member and legs extending from it to create a cavity. It is coupled to the array of second bumps and is designed to operate as a heat sink or shielding layer. The shielding layer establishes a ground connection through the array of second bumps. Notably, the first and second bumps are manufactured to have similar height and width, allowing them to be formed in the same manufacturing step. A protective layer, such as conductive epoxy, is applied over the array of second bumps.

Career Highlights

Mark Sackett is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and reliable.

Collaborations

Throughout his career, Mark has collaborated with talented individuals such as Hermes T Apale and KyuWon Lee. These collaborations have contributed to the development of cutting-edge technologies in the semiconductor field.

Conclusion

Mark Sackett is a distinguished inventor whose work in semiconductor technology has led to significant advancements in the industry. His innovative patents and collaborations reflect his commitment to enhancing the performance of semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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