logo

For the Inventor, By the Inventor

Colorado Springs, CO, United States of America

Mark S Lewis

This inventor holds 7 USPTO granted patents. Top assignee: Digital Equipment Corporation. Active years: 1993-1999.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mark S Lewis. Retrieved from https://idiyas.com/inventor/mark-s-lewis-nvc7rqrp

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 7

% Patents Active = 100.0

Average Co-Inventor Count = 2.3

ph-index = 7

Forward Citations = 162(Granted Patents)


Location History:

  • Monument, CO (US) (1993)
  • Colorado Springs, CO (US) (1994 - 1999)

Company Filing History:

goldMedal7 out of 2,297 
 
Digital Equipment Corporation
 patents

Years Active: 1993-1999

Loading Chart...
7 patents (USPTO):Explore Patents
1. 5995377 - Reduced static raid enclosure (1999-11-30),
2. 5814762 - Grounding for enclosures (1998-09-29),
3. 5483423 - EMI shielding for components (1996-01-09),
4. D353800 - Modular enclosure for electronic equipment (1994-12-27),
5. 5313595 - Automatic signal termination system for a computer bus (1994-05-17),
6. 5313369 - Reduced tolerance interconnect system (1994-05-17),
7. D332256 - Housing for a removable disk drive (1993-01-05),

Title: Mark S Lewis: Innovator in Electronic Device Enclosures

Introduction

Mark S Lewis is a notable inventor based in Colorado Springs, CO (US). He has made significant contributions to the field of electronic device enclosures, holding a total of 7 patents. His innovative designs focus on reducing electromagnetic interference (EMI) and electrostatic discharge (ESD) in electronic devices.

Latest Patents

One of his latest patents is the "Reduced Static Raid Enclosure." This invention features a low static enclosure designed to hold an electronic device securely. The enclosure includes opposing walls with guide rails, a bottom, a top, and a backplane that houses an electric connector. The design allows the electronic device to slide smoothly along the bottom and top, ensuring a proper connection with the backplane's electric connector. The continuous flat surfaces of the enclosure help to minimize ESD between the surfaces and the electronic device.

Another significant patent is the "Grounding for Enclosures." This apparatus aims to reduce EMI generated by a circuit. It improves the grounding of an enclosure by incorporating shaped protuberances that penetrate a conductive region of a circuit board. When the circuit board is mounted, these protuberances create penetrating electrical contact, providing additional ground paths and effectively reducing EMI.

Career Highlights

Mark S Lewis is currently employed at Digital Equipment Corporation, where he continues to innovate in the field of electronic devices. His work has been instrumental in enhancing the performance and reliability of electronic enclosures.

Collaborations

Throughout his career, Mark has collaborated with notable colleagues, including Ralph M Tusler and Reuben Michael Martinez. These partnerships have contributed to the development of advanced technologies in electronic device design.

Conclusion

Mark S Lewis is a distinguished inventor whose work in electronic device enclosures has led to several important patents. His innovative solutions address critical issues such as EMI and ESD, making significant strides in the field of electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…