Digital Equipment Corporation

Mark S Lewis

Ralph M Tusler

Reuben Michael Martinez

Lori A Treseder

Ronald R Ravey

Greg Suzda

A low static enclosure has an interior for holding an electronic device therein. The electronic device has opposing walls each having a guide rail thereon. The enclosure has a bottom, a top, and a backplane between the bottom and top at their respective back edges. The backplane has an electric connector on its interior surface. The bottom and top each have a flat continuous interior facing surface with a groove extending from the front edge to the back edge. The grooves on the bottom and top are for cooperation with the guide rails on the opposing walls of the electronic device to slide the electronic device along the bottom and top respectively so that an electric connector on the electronic device mates with the electric connector on the interior surface of the backplane. The flat continuous interior facing surfaces of the bottom and top discourage ESD between the surfaces and the electronic device.

Reduced static raid enclosure

An apparatus is provided to reduce the amount of EMI generated by a circuit. The grounding of an enclosure is improved by providing a number of shaped protuberances, the protuberances having an end that penetrates a conductive region of a circuit board, such that when the circuit board is mounted to the support member, the protuberances make a penetrating electrical contact and provides for additional ground paths, thereby reducing the EMI generated by the assembly.

Grounding for enclosures

This disclosure pertains to an apparatus and method of providing EMI shielding for an electrical component. The apparatus includes an elastomeric gasket, which is coated with a conductive jacket, and which is mounted on the backplane of a cabinet, the backplane providing EMI shielding. The cabinet is adapted for the insertion of a plurality of electrical components, such as disk drives, tape drives, and power supplies, which themselves are mounted in a rigid frame member. The frame member includes EMI shielding for the components on five of their six sides. The sixth side is unshielded, due to the fact that it contains the electrical connector used to connect the component to the backplane of the cabinet, when the frame member is inserted in the cabinet. With the frame member providing shielding on five sides, and the backplane providing shielding for the sixth side, the gasket serves the purpose of establishing an electrical seal between the frame member and the backplane of the cabinet.

EMI shielding for components

Modular enclosure for electronic equipment

An automatic termination system for an end terminated bus especially useful with the SCSI bus. When utilized with a computer device, for example, a storage subsystem, configuration or reconfiguration of the bus can be automatically effectuated without concerns for inappropriate signal termination of the bus. The invention comprises a circuit which determines if any additional devices have been coupled to the bus and enables an active terminator chip if none is detected. Should another device be coupled onto the bus, the active terminator chip is automatically disabled.

Automatic signal termination system for a computer bus

A simple, low cost, reduced tolerance interconnect enclosure in which a blind m A siVpV:interconnect between modules and the backplane may be guaranteed without the need for assembly fixtures or floating connectors, and a method of manufacturing the enclosure. The enclosure includes two matching enclosure sections for holding a backplane. The backplane has spaced apart recesses on opposing edges. Each enclosure section includes alignment protrusions spaced apart to engage the backplane recesses. These protrusions have curved apex regions and a height greater than the depth of the backplane recesses. Means for latching the enclosure sections together are provided, and the enclosure sections are dimensioned such that when the enclosure sections are closed around the backplane, the protrusions from the enclosure sections are urged against the recesses on the backplane. The resulting multi-point-of-contact interference fit between the backplane recesses and alignment protrusions automatically centers the backplane in the shelf. The process for manufacturing the enclosure includes the steps of drilling holes in a panel and routing the backplanes from the panel such that the routing path crosses the drilled holes, creating recesses on the backplane edges. The enclosure sections are manufactured according to a unitary injection molded plastic process.

Growing community of inventors

Colorado Springs, CO, United States of America

Mark S Lewis