Company Filing History:
Years Active: 2007-2011
Title: **Mark Ellsberry: Innovator in Electronic Assemblies**
Introduction
Mark Ellsberry is a distinguished inventor based in Santa Clara, California, known for his contributions to the field of electronic assemblies. With two patents to his name, Ellsberry’s innovations focus on enhancing memory density and efficiency in chip-scale packaging.
Latest Patents
Ellsberry's latest inventions include a stackable electronic assembly designed to improve memory density within confined spaces. This invention utilizes a novel staggered routing scheme that ensures uniform trace routing across all levels of the stacked architecture, allowing for efficient access to individual memory devices. The implementation features a ball grid array chip-scale package architecture combined with thermally compatible materials, significantly reducing the risk of thermal cracking while enhancing heat dissipation. Additionally, the design accommodates the incorporation of support components like capacitors and resistors directly on the chip-scale package, marking a significant advancement in electronic assembly technology.
Career Highlights
Mark Ellsberry currently works at Sanmina-SCI Corporation, a global leader in integrated manufacturing services. His tenure at the company has positioned him at the forefront of innovations in electronic assembly, where he applies his expertise in developing advanced packaging solutions that respond to the growing demands for efficiency and performance in electronic devices.
Collaborations
During his career, Ellsberry has collaborated with several talented professionals, including Charles E. Schmitz and Chi She Chen. These partnerships have been crucial in fostering an innovative environment, enabling the development of cutting-edge electronic solutions.
Conclusion
With a strong focus on improving electronic assembly technologies, Mark Ellsberry continues to make significant strides in the industry. His patents reflect a commitment to advancing memory density and heat dissipation in electronic devices, showcasing the impact of his work on modern technology.