South Burlington, VT, United States of America

Mark Curtis Hayes Lamorey

This inventor holds 5 USPTO granted patents. Top assignees: International Business Machines Corporation, Globalfoundries Inc.. Active years: 2007-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mark Curtis Hayes Lamorey. Retrieved from https://idiyas.com/inventor/mark-curtis-hayes-lamorey

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 60.0

Average Co-Inventor Count = 3.9

ph-index = 3

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 2007-2016

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5 patents (USPTO):Explore Patents

Title: Inventor Mark Curtis Hayes Lamorey: Pioneering EMI Shielding Technologies

Introduction

Mark Curtis Hayes Lamorey, a talented inventor based in South Burlington, VT, has made significant contributions to the field of electromagnetic interference (EMI) shielding technologies. With a total of five patents to his name, Lamorey’s work underscores the importance of innovation in enhancing electronic package designs and improving performance.

Latest Patents

Lamorey’s latest patents focus on organic module EMI shielding structures and methods, specifically an apparatus and methods for an electronic package that incorporates shielding against emissions of electromagnetic interference (EMI). His patented designs detail an integrated circuit structure that includes several critical components such as a substrate on a printed circuit board and an integrated circuit chip that is connected electrically. A notable aspect of his latest patents is the EMI shielding unit, which consists of a lid covering the integrated circuit chip along with parts of the substrate.

Furthermore, the fill material within the cavity formed between the lid and the substrate is composed of EMI absorbing material. The design also features a periphery lid equipped with a side skirt, which encircles the integrated circuit chip and substrate, alongside EMI absorbing material positioned on the printed circuit board that aids in reducing interference.

Career Highlights

Mark Lamorey has built his career by working with leading technology firms. Notably, he has been associated with the International Business Machines Corporation (IBM) and Globalfoundries Inc., where he engaged in innovation and developed advanced electronic packaging solutions. His work has been vital in adapting cutting-edge technologies for real-world applications, ensuring high reliability in electronic devices.

Collaborations

Throughout his career, Lamorey has collaborated with fellow innovators Yu Lu and Janusz Jozef Nowak. These partnerships have fostered an environment of creativity and teamwork that has resulted in groundbreaking advancements in the field of EMI shielding.

Conclusion

Mark Curtis Hayes Lamorey stands out as a dedicated inventor whose latest advancements in EMI shielding technologies demonstrate his passion for innovation. His contributions not only enhance the efficacy of electronic packages but also pave the way for future developments in the industry. With an ever-expanding patent portfolio, Lamorey continues to make a mark in the world of electronics, showcasing the vital role inventors play in shaping technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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