Mark Allen

Title: Mark Allen: Innovator in Semiconductor Packaging

Introduction

Mark Allen is a prominent inventor based in Gilbert, AZ (US). He has made significant contributions to the field of semiconductor packaging, particularly through his innovative patent related to backside metallization.

Latest Patents

Mark Allen holds a patent for "Backside metallization (BSM) on stacked die packages and external silicon at wafer level, singulated die level, or stacked dies level." This patent encompasses semiconductor packages and methods for forming these packages. The invention includes a plurality of first dies on a substrate, an interface layer over the first dies, and a backside metallization (BSM) layer directly on the interface layer. The BSM layer consists of first, second, and third conductive layers, with the first layer made of titanium, the second layer of nickel-vanadium, and the third layer comprising gold, silver, or copper materials. The semiconductor package may also include a plurality of second dies on a package substrate, with the second dies having top surfaces substantially coplanar to the top surface of the first dies.

Career Highlights

Mark Allen is currently employed at Intel Corporation, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing the efficiency and performance of semiconductor packages.

Collaborations

Throughout his career, Mark has collaborated with notable colleagues, including Chandra Mohan Jha and Prasad Ramanathan. These collaborations have further enriched his contributions to the field.

Conclusion

Mark Allen's innovative work in semiconductor packaging exemplifies the impact of dedicated inventors in advancing technology. His patent on backside metallization showcases his expertise and commitment to improving semiconductor performance.