Hawthorne, CA, United States of America

Mark A Weaver


Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 16(Granted Patents)


Location History:

  • Redondo Beach, CA (US) (1991)
  • Hawthorne, CA (US) (2001)

Company Filing History:


Years Active: 1991-2001

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2 patents (USPTO):Explore Patents

Title: Mark A Weaver: Innovator in Electronic Assembly Technologies

Introduction

Mark A Weaver is a notable inventor based in Hawthorne, CA (US). He has made significant contributions to the field of electronic assembly, particularly in the development of innovative adhesive and soldering techniques. With a total of 2 patents, Weaver's work has had a lasting impact on the industry.

Latest Patents

Weaver's latest patents include "Co-processing of adhesive curing and solder reflow in an electronic assembly operation." This invention describes a method for fabricating electronic assemblies by tinning solder to the bonding pads of a printed circuit board and applying a filled polyurethane adhesive to the components. The assembly is then heated in a single solder temperature/time reflow cycle, allowing for simultaneous curing of the adhesive and soldering of electrical contacts. Another significant patent is the "Modified polyurethane flow-under thermal transfer adhesive," which is a thermal transfer adhesive composition applied after electronic components have been installed on a printed wiring board.

Career Highlights

Throughout his career, Mark A Weaver has worked with prominent companies such as Hughes Electronics Corporation and Hughes Aircraft Company. His experience in these organizations has contributed to his expertise in electronic assembly technologies.

Collaborations

Weaver has collaborated with notable colleagues, including Lynn E Long and Thomas W Martinez, further enhancing his innovative work in the field.

Conclusion

Mark A Weaver's contributions to electronic assembly technologies through his patents and career experiences highlight his role as a significant inventor in the industry. His innovative approaches continue to influence the development of electronic assembly processes.

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