The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2001
Filed:
Aug. 19, 1998
Mark A. Weaver, Hawthorne, CA (US);
Lynn E. Long, Manhattan Beach, CA (US);
Thomas Martinez, Long Beach, CA (US);
Eric J. Shinaver, South Pasadena, CA (US);
Hughes Electronics Corporation, El Segundo, CA (US);
Abstract
An electronic assembly is fabricated by tinning a solder to the electrical bonding pads of a printed circuit board, and applying an adhesive, preferably a filled polyurethane adhesive, to the component that is to be bonded to the printed circuit board. The component is contacted to its bonding location on the printed circuit board, and the electrical contact on the component is contacted to the tinned bonding pads. The assembly is heated in a single solder temperature/time reflow cycle to simultaneously cure the adhesive and solder the electrical contacts to the bonding pads.