Company Filing History:
Years Active: 2001
Title: The Innovative Contributions of Eric J Shinaver
Introduction
Eric J Shinaver is a notable inventor based in South Pasadena, CA. He has made significant contributions to the field of fiber optics and electronic assembly, holding a total of 2 patents. His work reflects a commitment to advancing technology and improving existing systems.
Latest Patents
One of Shinaver's latest patents is for a "Compact package structure for fiber optic devices." This invention features a fiber-optic device package structure that includes multiple optical stage subassemblies arranged in a parallel, facing configuration. Each subassembly consists of a thermal/structural plate, an annular plurality of turns of fiber-optic fiber, and a light connector. The design allows for a freestanding annulus of fiber-optic fiber encapsulated within an encapsulant, enhancing the efficiency of fiber-optic devices.
Another significant patent is for the "Co-processing of adhesive curing and solder reflow in an electronic assembly operation." This innovative process involves tinning solder to the bonding pads of a printed circuit board and applying a filled polyurethane adhesive to the component being bonded. The assembly is then heated in a single reflow cycle, which simultaneously cures the adhesive and solders the electrical contacts to the bonding pads, streamlining the manufacturing process.
Career Highlights
Throughout his career, Eric J Shinaver has worked with prominent companies such as The Boeing Company and Hughes Electronics Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to advancements in technology.
Collaborations
Shinaver has collaborated with talented individuals in his field, including Brian J Fujimori and Andrew J Bristol. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
Eric J Shinaver's contributions to the fields of fiber optics and electronic assembly demonstrate his innovative spirit and dedication to technological advancement. His patents reflect a deep understanding of engineering principles and a commitment to improving existing technologies.