Munich, Georgia

Mario Baum


Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Mario Baum

Introduction

Mario Baum is a notable inventor based in Munich, Germany. He has made significant contributions to the field of microstructures, particularly through his innovative patent related to reactive bonding. His work exemplifies the intersection of advanced materials science and engineering.

Latest Patents

Mario Baum holds a patent for a microstructure with reactive bonding. This invention features a bonding substrate and a reactive multilayer system. The reactive multilayer system includes at least one surface layer of the bonding substrate with vertically oriented nanostructures that are spaced apart. The regions between these nanostructures are filled with materials that act as reaction partners with respect to the nanostructures. The method for producing this system involves patterning or depositing the surface layer to create the nanostructures. The resulting microsystem can function as a sensor and may include biomaterials, polymeric components, and elements with magnetic, piezoelectric, or piezoresistive properties.

Career Highlights

Throughout his career, Mario Baum has worked with esteemed organizations such as the Fraunhofer Society for the Advancement of Applied Research and the Technical University of Chemnitz. His experience in these institutions has allowed him to develop and refine his innovative ideas in the field of microstructures.

Collaborations

Mario has collaborated with notable colleagues, including Joerg Braeuer and Thomas Gessner. Their joint efforts have contributed to the advancement of technology in their respective fields.

Conclusion

Mario Baum's innovative work in microstructures and reactive bonding showcases his expertise and dedication to advancing technology. His contributions are significant in the realm of materials science and engineering.

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