Schwarzenfeld, Germany

Maria Heidenblut

USPTO Granted Patents = 5 

Average Co-Inventor Count = 3.7

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2012-2025

where 'Filed Patents' based on already Granted Patents

5 patents (USPTO):

Title: Innovator Spotlight: Maria Heidenblut

Introduction: Maria Heidenblut, an accomplished inventor based in Schwarzenfeld, Germany, has made significant contributions to the field of semiconductor technology. With a total of four patents to her name, she has established herself as a key figure in innovation.

Latest Patents: Among her latest patents is a groundbreaking development in wafer technology. This patent details a wafer that includes at least one metallization structure with at least one opening, as well as a separation line region where the wafer is to be diced. Notably, this separation line region intersects with the opening, enhancing the efficiency of wafer processing.

Career Highlights: Maria's significant contributions to Infineon Technologies AG have not only advanced her career but have also impacted the semiconductor industry at large. Her work focuses on improving manufacturing processes and creating innovative solutions that address current technological challenges.

Collaborations: Throughout her career, Maria has collaborated closely with notable professionals like Gunther Mackh and Gerhard Leschik. Their collective expertise has facilitated the development of cutting-edge technologies and contributed to the success of their projects.

Conclusion: Maria Heidenblut exemplifies the spirit of innovation in the semiconductor industry. With her impressive portfolio of patents and collaborations, she continues to pave the way for future advancements in wafer processing technology. Her dedication to her work at Infineon Technologies AG is a testament to the impact that inventors can make in their fields.

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