The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

Jan. 24, 2022
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Sergey Ananiev, Ottobrunn, DE;

Andreas Bauer, Regensburg, DE;

Michael Goroll, Poing, DE;

Maria Heidenblut, Schwarzenfeld, DE;

Stefan Kaiser, Aschheim, DE;

Gunther Mackh, Neumarkt, DE;

Kabula Mutamba, Pentling, DE;

Reinhard Pufall, Munich, DE;

Georg Reuther, Munich, DE;

Assignee:

INFINEON TECHNOLOGIES AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01);
Abstract

A semiconductor chip having a crack stop structure is disclosed. The crack stop structure includes one or more recesses formed in the semiconductor chip. The one or more recesses extend adjacent to and along a periphery of the semiconductor chip. The one or more recesses are filled with a metal material. The metal material has an intrinsic tensile stress at room temperature that induces compressive stress in at least a region of the periphery of the semiconductor chip.


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