Maria Angela Damille Ramiso

Title: Maria Angela Damille Ramiso: Innovator in Electronic Packaging Technology

Introduction

Maria Angela Damille Ramiso is a prominent inventor based in Folsom, CA (US). She has made significant contributions to the field of electronic packaging technology, holding a total of 3 patents. Her work focuses on innovative solutions that enhance the performance and reliability of integrated circuit assemblies.

Latest Patents

Among her latest patents is the "Stepped electronic substrate for integrated circuit packages." This invention involves an integrated circuit assembly that features a stepped electronic substrate with distinct surface portions. The design allows for efficient electrical attachment of integrated circuit devices and facilitates connections between multiple assemblies through an anisotropic conductive layer. Another notable patent is the "Fiber reinforced stiffener," which describes electronic packages that incorporate fiber reinforcement within their substrate layers. This innovation aims to improve the structural integrity and performance of electronic packages.

Career Highlights

Maria Angela Damille Ramiso is currently employed at Intel Corporation, where she continues to push the boundaries of electronic packaging technology. Her expertise and innovative mindset have positioned her as a valuable asset to the company and the industry as a whole.

Collaborations

Throughout her career, Maria has collaborated with talented individuals such as Florence R Pon and Tyler Leuten. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Maria Angela Damille Ramiso exemplifies the spirit of innovation in the field of electronic packaging. Her contributions through her patents and collaborations highlight her commitment to advancing technology and improving electronic systems.