Marcelis Bout

Title: Marcelis Bout - Innovator in Through-Wafer Via Technology.

Introduction

Marcelis Bout is a notable inventor based in Noord-Brabant, Netherlands. He has made significant contributions to the field of semiconductor technology, particularly with his innovative designs and methods.

Latest Patents

Marcelis Bout holds a patent for a through-wafer via device and method of manufacturing the same. This invention relates to a device comprising a wafer made of a specific material, featuring a first and a second wafer surface. The device includes multiple side-by-side trenches filled with conductive material, which extend from the first wafer surface into the wafer. These trenches create spacers of the wafer material between them. Additionally, a second trench is connected to the first trenches, also filled with conductive material. The invention ensures that the conductive layer formed on the first wafer surface has a substantially planar and closed surface. This patent showcases Bout's expertise in enhancing the functionality and efficiency of semiconductor devices.

Career Highlights

Marcelis Bout is associated with Koninklijke Philips Corporation N.V., a leading company in the technology and healthcare sectors. His work at Philips has allowed him to focus on innovative solutions that push the boundaries of current technology. With a patent portfolio that includes one significant patent, Bout has established himself as a key player in his field.

Collaborations

Throughout his career, Marcelis has collaborated with talented individuals such as Ronald Dekker and Marcel Mulder. These partnerships have fostered an environment of innovation and creativity, leading to advancements in technology.

Conclusion

Marcelis Bout is a distinguished inventor whose work in through-wafer via technology has made a lasting impact on the semiconductor industry. His contributions continue to influence the development of advanced electronic devices.